|
Class III
(≥) |
Class IV
(≥) |
Class V
(≥) |
|
|
WIDTH FOR TRACKS
|
 |
||
| 0,3 | 0,2 | 0,15 | |
|
DISTANCE BETWEEN TRACKS
|
 |
||
| 0,3 | 0,2 | 0,15 | |
|
DISTANCE BETWEEN TRACK AND COPPER PAD
|
 |
||
| 0,3 | 0,2 | 0,15 | |
|
DISTANCE BETWEEN TRACK AND PCB EDGE
|
 |
||
| 0,5 | 0,5 | 0,5 | |
|
DISTANCE BETWEEN PAD AND PCB EDGE
|
 |
||
| 0,5 | 0,5 | 0,5 | |
|
DISTANCE BETWEEN CONDUCTOR AND NON PLATED
HOLE |
 |
||
| 0,20 | 0,20 | 0,20 | |
|
MINIMUM ANNULAR RING
|
 |
||
| 0,3 | 0,2 | 0,15 | |
|
SILKSCREENED SOLDERMASK CLEARANCE
|
 |
||
| 0,15 | 0,10 | 0,05 | |
|
MINIMUM PLATED HOLE
|
 |
||
| 0,5 | 0,5 | 0,35 | |
|
MINIMUM NON PLATED HOLE
|
 |
||
| 0,6 | 0,4 | 0,50 | |
| PLATED HOLE DIAMETER TOLERANCE | 0.10 |
 |
|
| UNPLATED HOLE DIAMETER TOLERANCE | 0.05 |
 |
|
| PCB THICKNESS TOLERANCE | ±10% |
 |
|
| PLATING THICKNESS, HOLES |
Average 25µ Minimum 20µ |
 |
|
| TRACK WIDTH TOLERANCE |
18µ ± 20% 35-70µ ± 25% |
 |
|
| COPPER CLEARANCE FOR SCORING | 1.0 |
 |
|
| SCORING POSITIONAL ACCURACY | ±0.10 |
 |
|
| CORE SCORING | ±0.12 |
 |
|
| OUTER DIMENSIONS TOLERANCE | 0.20 |
 |
|
| SOLDERMASK MINIMUM LINE | 0.15 |
 |
|
| LEGEND MINIMUM LINE | 0.20 |
 |
|
| GRAPHITE (CONDUCTIVE INK) OVERLAPPING | 0.20 |
 |
|
| MINIMUM DISTANCE BETWEEN GRAPHITE PADS | 0.8 |
 |
|
|
MINIMUM DISTANCE BETWEEN GRAPHITE AND CONDUCTOR |
0.8 |
 |
|
|
PEELABLE OVERLAPPING |
1.0 |
 |
|
Technical information
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